A system called 3D Vapor Cloud Chamber (abbreviated as 3D VCC) will be able to cool smartphones. Certification passed in China National Intellectual Property Administration.
Infinix says that their development is strikingly different from the classic heat dissipation methods in mobile gadgets, while at the same time it is more efficient. The thermal cooling chamber will increase the capacity of the cooler by 20%.
The protrusion of the cooling chamber provides almost direct contact with the chipset of the device, which allows to increase the coefficient of thermal conductivity and the degree of heat dissipation. Compared to the 2D counterparts of a similar system, Infinix technology can reduce the temperature by almost 3 degrees, while the heat spread increases by 12.5%.
The company's specialists literally sweated over the creation of the 3D VCC structure, making it stronger. Based on the results of the tests, a 3D configuration of the matrix support column was developed, which works to balance the flatness and size of the heat chamber. Also, an important achievement of the developers was the preservation of the integral configuration of the wick in the heat chamber, since the usual formation can harm the integrity of the entire chamber and thereby disrupt the entire operation of the device. The result was achieved through a comprehensive analysis of density, at the same time, technological methods of welding were used. In addition, the developers paid attention to the correct location of the hole in the frontal zone of the case and the strength of the alloy. This made it possible to reduce the temperature resistance of the conduction medium.
Infinix intends to create even thinner cooling chambers with an increased number of protrusions. Also, the company is going to use new materials and integrate its newly developed technology into the central frame of the smartphone.
Infinix says that their development is strikingly different from the classic heat dissipation methods in mobile gadgets, while at the same time it is more efficient. The thermal cooling chamber will increase the capacity of the cooler by 20%.
The protrusion of the cooling chamber provides almost direct contact with the chipset of the device, which allows to increase the coefficient of thermal conductivity and the degree of heat dissipation. Compared to the 2D counterparts of a similar system, Infinix technology can reduce the temperature by almost 3 degrees, while the heat spread increases by 12.5%.
The company's specialists literally sweated over the creation of the 3D VCC structure, making it stronger. Based on the results of the tests, a 3D configuration of the matrix support column was developed, which works to balance the flatness and size of the heat chamber. Also, an important achievement of the developers was the preservation of the integral configuration of the wick in the heat chamber, since the usual formation can harm the integrity of the entire chamber and thereby disrupt the entire operation of the device. The result was achieved through a comprehensive analysis of density, at the same time, technological methods of welding were used. In addition, the developers paid attention to the correct location of the hole in the frontal zone of the case and the strength of the alloy. This made it possible to reduce the temperature resistance of the conduction medium.
Infinix intends to create even thinner cooling chambers with an increased number of protrusions. Also, the company is going to use new materials and integrate its newly developed technology into the central frame of the smartphone.
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