The new product is an improved version of the Dimensity 7200 chip. It will appear in the upcoming Redmi smartphone.
Dimensity 7200 Ultra is built on TSMC 4nm 2nd generation process technology. The device uses a dual-core Cortex-A715 (2.8 GHz) as a central processor, complemented by six energy-efficient Cortex-A510 cores, Mali-G610 MC4 graphics and an APU 650 artificial intelligence chip. In addition, it is known that the chipset will support RAM LPDDR5 and UFS 3.1 format permanent memory. Photos and videos will be processed by the Imagiq 765 ISP processor, which can work with cameras up to 200 megapixels.
The processor will also support proprietary HyperEngine 5.0 technology, which provides increased performance in games. Other features worth noting include support for screens with a maximum refresh rate of 144 Hz, 5G networks, Wi-Fi 6E and Bluetooth 5.3.
Dimensity 7200 Ultra will debut in the Redmi Note 13 Pro+ smartphone, it will be presented very soon.
Dimensity 7200 Ultra is built on TSMC 4nm 2nd generation process technology. The device uses a dual-core Cortex-A715 (2.8 GHz) as a central processor, complemented by six energy-efficient Cortex-A510 cores, Mali-G610 MC4 graphics and an APU 650 artificial intelligence chip. In addition, it is known that the chipset will support RAM LPDDR5 and UFS 3.1 format permanent memory. Photos and videos will be processed by the Imagiq 765 ISP processor, which can work with cameras up to 200 megapixels.
The processor will also support proprietary HyperEngine 5.0 technology, which provides increased performance in games. Other features worth noting include support for screens with a maximum refresh rate of 144 Hz, 5G networks, Wi-Fi 6E and Bluetooth 5.3.
Dimensity 7200 Ultra will debut in the Redmi Note 13 Pro+ smartphone, it will be presented very soon.
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