The vendor presented the Dimensity 1050, Dimensity 930 and Helio G99 chipsets. The first two are based on TSMC's 6nm process technology. First of all, they plan to install them on devices of the mid-budget segment that support 5G.
The Dimensity 1050 is the first chip from the company to support mmWave. With it, the company intends to enter the American market, where Qualcomm currently holds the leadership among Android smartphones. The processor itself is a slightly stripped-down Dimensity 1100. The new CPU contains a pair of high-performance Cortex-A78 cores (2.5 GHz), six energy-efficient Cortex-A55 (2.0 GHz) and a Mali-G710 GPU. In addition, Dimensity 1050 will support LPDDR5 RAM and UFS 3.1 flash memory, and will also be able to work with cameras up to 108 MP, Full HD + screens up to 144 Hz and Wi-Fi 6E standard.
Dimensity 930 will act as a successor to Dimensity 810. The processor has all the same Cortex-A78 cores, but with a maximum frequency of 2.2 Hz. It also contains a Cortex-A55 six and an Imagination BXM-2-256 video accelerator. Like Dimensity 1050, there is support for LPDDR5 RAM and UFS 3.1. The processor will be able to work with cameras up to 64 MP and Full HD + screens with a scan up to 120 Hz.
Helio G99, in turn, will replace Helio G96. The chipset is also based on the 6nm process, however it can only support 4G networks. Technical specifications of the processor have not been disclosed, it is only known that the device will consume 30% less energy compared to its predecessor.
The first devices with Dimensity 1050 will appear in July-September this year, while smartphones with Helio G99 on board should be expected in the very near future.
The Dimensity 1050 is the first chip from the company to support mmWave. With it, the company intends to enter the American market, where Qualcomm currently holds the leadership among Android smartphones. The processor itself is a slightly stripped-down Dimensity 1100. The new CPU contains a pair of high-performance Cortex-A78 cores (2.5 GHz), six energy-efficient Cortex-A55 (2.0 GHz) and a Mali-G710 GPU. In addition, Dimensity 1050 will support LPDDR5 RAM and UFS 3.1 flash memory, and will also be able to work with cameras up to 108 MP, Full HD + screens up to 144 Hz and Wi-Fi 6E standard.
Dimensity 930 will act as a successor to Dimensity 810. The processor has all the same Cortex-A78 cores, but with a maximum frequency of 2.2 Hz. It also contains a Cortex-A55 six and an Imagination BXM-2-256 video accelerator. Like Dimensity 1050, there is support for LPDDR5 RAM and UFS 3.1. The processor will be able to work with cameras up to 64 MP and Full HD + screens with a scan up to 120 Hz.
Helio G99, in turn, will replace Helio G96. The chipset is also based on the 6nm process, however it can only support 4G networks. Technical specifications of the processor have not been disclosed, it is only known that the device will consume 30% less energy compared to its predecessor.
The first devices with Dimensity 1050 will appear in July-September this year, while smartphones with Helio G99 on board should be expected in the very near future.
Login or register to post comments
Comments 0