MediaTek has released two new mobile chipsets. They are designed for powerful mobile devices in the mid-budget segment. It is known that the processors will support 5G and interaction with high-definition cameras. The manufacturer also presented the Dimensity 1300 processor - an improved modification of the previous flagship with minor edits.
Dimensity 8100, built on a five-nanometer process technology, has 4 high-performance ARM Cortex-A78 cores (2.85 GHz), 4 energy-efficient Cortex-A55 cores (2.0 GHz) and a Mali-G610 MC6 GPU. The chipset has an Imagic 780 ISP photo and video processing microprocessor, offering synchronous HDR movie production from two cameras and support for recording HDR10+ video in 4K resolution at 60 frames per second. However, it will be able to support 200MP camera sensors and 2x zoom without compromising image quality.
The APU 580 neural block is responsible for the operation of the artificial intelligence system in the processor: according to the technical specification, it should be faster than the previous version of the block. In addition, the chip has acquired a 3GPP Release-16 5G modem supporting 5G DSDS and demonstrating the ultimate forward link performance of 4.7 Gbps. The processor also supports Bluetooth 5.3, Wi-Fi 6E and Bluetooth LE Audio.
The Dimensity 8000 chipset is a simplified version of the above chipset with similar parameters. The only differences between them are the lower frequency of high-performance cores (2.75 GHz) and support for screens up to Full HD + and up to 168 Hz. Dimensity 8100, in turn, can support QHD+ resolution at 120 Hz.
Now the MediaTek Dimensity chipset is produced based on TSMC's 6nm architecture. The processor has a high-performance Cortex-A78 core with a frequency of 3.0 GHz, 3 identical cores, but already at 2.6 GHz, and 4 efficient Cortex-A55 cores at 2.0 GHz. The Mali-G77 MC9 video accelerator, which supports HyperEngine 5.0 gaming technology, is responsible for the graphics. The processor has the ability to interact with 200 MP cameras, LPDDR4X-4266 RAM up to sixteen gigabytes and UFS 3.1 storage.
The maximum possible screen resolution supported by this processor is 2520×1080 pixels with a scan up to 168 Hz. In addition, the chipset works with communication standards such as Bluetooth 5.2, Wi-Fi 6 and 5G networks at speeds up to 4.7 Gbps. The timing of the release of devices with new chips will be known later.
Dimensity 8100, built on a five-nanometer process technology, has 4 high-performance ARM Cortex-A78 cores (2.85 GHz), 4 energy-efficient Cortex-A55 cores (2.0 GHz) and a Mali-G610 MC6 GPU. The chipset has an Imagic 780 ISP photo and video processing microprocessor, offering synchronous HDR movie production from two cameras and support for recording HDR10+ video in 4K resolution at 60 frames per second. However, it will be able to support 200MP camera sensors and 2x zoom without compromising image quality.
The APU 580 neural block is responsible for the operation of the artificial intelligence system in the processor: according to the technical specification, it should be faster than the previous version of the block. In addition, the chip has acquired a 3GPP Release-16 5G modem supporting 5G DSDS and demonstrating the ultimate forward link performance of 4.7 Gbps. The processor also supports Bluetooth 5.3, Wi-Fi 6E and Bluetooth LE Audio.
The Dimensity 8000 chipset is a simplified version of the above chipset with similar parameters. The only differences between them are the lower frequency of high-performance cores (2.75 GHz) and support for screens up to Full HD + and up to 168 Hz. Dimensity 8100, in turn, can support QHD+ resolution at 120 Hz.
Now the MediaTek Dimensity chipset is produced based on TSMC's 6nm architecture. The processor has a high-performance Cortex-A78 core with a frequency of 3.0 GHz, 3 identical cores, but already at 2.6 GHz, and 4 efficient Cortex-A55 cores at 2.0 GHz. The Mali-G77 MC9 video accelerator, which supports HyperEngine 5.0 gaming technology, is responsible for the graphics. The processor has the ability to interact with 200 MP cameras, LPDDR4X-4266 RAM up to sixteen gigabytes and UFS 3.1 storage.
The maximum possible screen resolution supported by this processor is 2520×1080 pixels with a scan up to 168 Hz. In addition, the chipset works with communication standards such as Bluetooth 5.2, Wi-Fi 6 and 5G networks at speeds up to 4.7 Gbps. The timing of the release of devices with new chips will be known later.
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