Loongson will launch a new 3D5000 chip with a series-record number of cores. To achieve this result, the company had to cheat a little.
From a technical point of view, the new device is a chiplet for the LGA 4129 socket. It consists of a pair of 3C500 chips based on the LoongArch architecture with 16 LA464 cores, support for four-channel DDR4-3200 RAM and 64 MB of cache with a backing. Four of these devices are capable of forming a combination of 128 cores with 8-channel memory.
Power consumption according to the vendor is 130 W (2.0 GHz) and 170 W (2.2 GHz). According to insiders in the SPEC CPU 2006 benchmark, the Loongson 3D5000 chipset was able to achieve a score of 400 points, and the combination of two processors - over 800 points.
Test shipments of the device should begin in the 1st half of 2023. Mass production of server chips is planned later.
From a technical point of view, the new device is a chiplet for the LGA 4129 socket. It consists of a pair of 3C500 chips based on the LoongArch architecture with 16 LA464 cores, support for four-channel DDR4-3200 RAM and 64 MB of cache with a backing. Four of these devices are capable of forming a combination of 128 cores with 8-channel memory.
Power consumption according to the vendor is 130 W (2.0 GHz) and 170 W (2.2 GHz). According to insiders in the SPEC CPU 2006 benchmark, the Loongson 3D5000 chipset was able to achieve a score of 400 points, and the combination of two processors - over 800 points.
Test shipments of the device should begin in the 1st half of 2023. Mass production of server chips is planned later.
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